平面激光切割

No. of machines: 1
Brand: TRUMPF
Model: TruLaser1030
Work area: 3000x1500mm
Posit. accuracy: ± 0.05 mm
Repeatability: ± 0.03 mm
Max speed: 140m/min
The company has introduced the TRUMPF-TruLaser1030 high-speed semiconductor laser cutting machine from Germany. The cutting speed can be up to 140 meters per minute. The patented BrightLine semiconductor laser emitters enablethe cutting operation to reach a new height: it enables solid-state lasers to cut thick steels with excellent quality. In addition to the ability to process various materials and sheets, it can also process tiny profiles and ultra-precision shapes easily with an accuracy deviation up to 0.03mm.
拥有设备数量: 1
品牌: TRUMPF
型号: TruLaser1030
加工尺寸: 3000x1500mm
定位精度: ± 0.05mm
重复精度: ± 0.03mm
切割速度: 140m/min
公司从德国引进了TRUMPF-TruLaser1030高速半导体激光切割机。切割速度高达140米每分钟。专利的BrightLine半导体激光发射器可以使切割作业达到更新的高度:它使固态激光器能够以优异的质量切割厚钢材。除了可以处理的各种各样的材料和薄片,更能够以高达0.03毫米的精度为您轻松处理微小的轮廓以及超精密造型。
   
 

© Copyright 2017 JGKame

Tianjin JG-KAME Metal Products CO.,LTD.